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| Technical Features |
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The Substrate Department of TSSC is devoted to the R&D effort of technologies leading the market in order to develop new technologies and expand product applications so as to raise competitive threshold and further to target at grasping the development of next generation products.
Under the trend of seeking for small size portable product, all kinds of electronic products are converting from the erecting or desktop designs in the past to portable and eventually wearing designs. The electronic components are also facing the requirement of thinning packaging. With such trend of technology evolution, the Substrate Department of TSSC in reaction to this is also focusing in the development of all kinds of thinning substrate and have already received patents award in quite a few countries. Below is a description of the thin substrate we have already released to the market:
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TQFN ( Thinnest Quad flat no lead ) |
The QFN package is the substrate with thickness of 30-50um. The design can be used in the IC packaging of logic/RF/PA/RAM/LED products. The thickness of packaging can be down to 0.3mm. |
ULGA ( Ultra thin Land Grid Array ) |
The thickness of LGA substrate is 120-180um. The design can be used in the IC packaging of logic/RF/PA /LED products and the IC is glued to copper during packaging so that heat can be dissipated outward directly. This is a kind of high dissipation plastic substrate. |
MLLGA ( Metal Leadframe type LGA ) |
The substrate has minimum thickness of 280um for MEM microphone application. The package thickness can be as thin as 1.0mm. In the substrate of 280um in thickness, a voice channel with 120um thickness is hidden inside. |
LLGA ( Leadframe type LGA ) |
This is a kind of high-pin count leadframe product , you can design leads position which is not limited at the 4 edges of substrate .The packaging resolves the process restriction that need tie-bar connect them to the strip frame. The solution provides a brand new leadframe structure with high pin counts. |
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Except for the superior talents and technologies in the semiconductor industry, the most important thing in Taiwan is the establishment of a complete industrial supplying chain. With the thin IC packaging gradually becoming the major trend of the industry, the government is aggressively promoting the industrial strategy of self-sufficiency in key electronic components in assisting semiconductor business owners providing customers more rapid, low cost, and high quality assembly components. To respond to such policy, the Substrate Department of TSSC strives to continue developing all kinds of thin substrate/packaging methods with customers and further to upgrade the overall competitiveness of Taiwan’s semiconductor industry. |
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