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Reverse Engineering ( Second Source Parts) |
| ––– Based on the familiarity to semiconductor equipment system |
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| The procedure is shown as below : |
| 1. Securing of Samples |
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2. Confirmation of sample functions (close communication with customer + understanding to semiconductor equipment system)
3. Material analysis of sample (range of material covered: special metallic material, highly pure precision ceramics, quartz, engineering plastics, fully fluoride rubber….. etc.)
4. Dimensions measurement of sample (precision measurement apparatus and working with famous measurement center in Taiwan)
5. Sample working environment analysis (understanding to semiconductor equipment system)
6. Design of sample tolerance with matting parts (close communication with customers + rich experience in semiconductor equipment systems)
7. Preparation of sample drawings |
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Cooperated with Highly Skilled Manufacturers all over the world |
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8. Preparation of product sample
9. Sending sample for customer’s approval
10. Official volume production |
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